DBC Ceramic Substrates for Electronics

DBC Ceramic Substrates for Electronics Performance Advantages of DBC Ceramic Substrates Direct Bonded Copper (DBC) technology is mainly a ceramic surface metallization technology developed based on alumina ceramic substrates. DBC ceramic substrate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength and low expansion of ceramics, as well as the high electrical conductivity and excellent welding performance of oxygen-free copper, and can be etched with various patterns like PCB circuit boards. 1. Good Insulation Performance Using the DBC ceramic substrate as the carrier of the chip can effectively isolate the chip from the heat dissipation bottom plate of the module. 2. Excellent Thermal Conductivity It can effectively dissipate heat from the chip and ensure the stability and reliability of the chip during operation. 3. Thermal Expansion Coefficient Close to Silicon DBC ceramic substrates have a thermal expan…